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Kulicke & Soffa Contributes Wedge Bonder Equipment to Singapore University of Technology and Design

27 Feb 2017

Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today its contribution of an automatic single-head semiconductor wedge bonder to the Engineering Product Development (EPD) Pillar of the Singapore University of Technology and Design (SUTD). Wedge Bonder equipment is used in interconnect technologies in a wide range of power semiconductor packages and modules such as the automotive, industrial, renewable energy, consumer and computing markets. New applications utilizing wedge bonder equipment are emerging, and one such application is in the manufacturing of batteries for electric vehicles. A presentation ceremony was held on the same day at the SUTD campus where the equipment was on display with live wire bonding demonstration.

Chan Pin Chong, Kulicke & Soffa’s Senior Vice President for AP-Hybrid, Electronics Assembly, Wedge Bonders, Capillaries and Blades Business Lines, said, “K&S believes in continuous learning as it opens doors to innovation and opportunities. As part of our corporate responsibility effort, we hope our contribution of the machine enables hands-on experience for the students, and inspires them in applying technology to real life applications.”

Professor Yeo Kiat Seng, SUTD's Associate Provost for Graduate Studies and International Relations said, "SUTD appreciates Kulicke & Soffa’s generous support of the automatic semiconductor wedge bonder. This equipment will provide our students with the desired hands-on experience and skills training in chip assembly, packaging, IC design and semiconductor. SUTD’s partnership with Kulicke & Soffa will mutually benefit both parties as it will catalyze research to greater heights and value-add to the industry and Singapore economy.” 

About Kulicke & Soffa 

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com