Overseas exposure
Experience diverse regional economies, cultures and contexts
Through overseas exchanges, design sprints, internships, and global competitions, students gain hands-on experience applying their learning beyond the classroom.
- Broaden your perspectives
- Build international networks
- Translate ideas into venture-ready concepts that address real-world challenges
The DAI programme offers expanded global exposure through overseas opportunities and strategic partnerships with leading institutions such as University of California, San Diego, the University of Chicago, Tokyo University of Science, Tsinghua University, and Shanghai Jiao Tong University. These experiences immerse students in diverse approaches to AI, design, and societal systems, deepening their understanding of how AI is developed, governed, and applied across different cultural, economic, and regulatory environments.
Opportunities
2026 International Summer Program: “Design Futures·Shared Vision”
Host university: Academy of Arts & Design, Tsinghua University
Programme schedule: Two weeks, from 29 June to 12 July 2026
The Academy of Arts & Design at Tsinghua University will launch its 2026 International Summer Program under the overarching theme “Design Futures· Shared Vision”. Building on the Academy’s strengths in interdisciplinary innovation and talent development, the programme will focus on three tracks: Resilient Aero-Urbanism, Resilient Blue-Life, and Resilient Socio-Digital.
Participants will apply emerging tools such as generative AI, data visualisation and scenario simulation, mixed-reality experiential environments, and environmental and behavioral sensing to develop innovative solutions that advance social resilience, ecological sustainability, and cultural diversity.
Antai Global Summer Program (AGSP)
Host university: Antai College of Economics and Management, Shanghai Jiao Tong University
Programme schedule: 6 – 24 July 2026
The Antai Global Summer Program (AGSP) was initiated in 2013. To date, the programme has welcomed more than 400 participants from over 30 countries and regions from top universities or business schools around the world, such as University of Cambridge, Harvard University, Northwestern University, University of British Columbia, University of Sydney, Technical University of Munich, University of Deusto and so on.
Participants will gain a deep understanding of the Chinese economy and culture throughout the three-week programme which is carefully planned to include in-class coursework, company visits, social events and cultural tours.
International Summer Research Program (ISRP)
Host university: University of California, San Diego (UCSD)
Period: Summer 2026
The ISRP is a research and practice-based summer programme (not coursework-based) and does not require an academic transcript issued by UCSD.
- Programme period: 28 June – 29 August 2026 (students must be available for the full duration)
- Programme fee: USD 6,000 (subject to UCSD’s final confirmation)
- Programme nature: Research or practical experience (non-coursework)
- Eligible students: Current Term 6 and 8 DAI and HASS Minor students
Partnership with the University of Chicago
Under our collaboration with the University of Chicago Division of the Social Sciences, students can enjoy benefits including the waiver of application fees when applying to UChicago’s master programmes in the Social Sciences.