Multi-axis 3D printing: advanced high-DOF manufacturing empowered by geometry computing

Multi-Axis Additive Manufacturing (MAAM) is revolutionising 3D printing by enabling non-planar material deposition in true three-dimensional space. This breakthrough unlocks transformative capabilities, including support-free fabrication, superior surface finishing, and precise control of filament orientation for mechanical reinforcement. However, these advances also introduce significant computational challenges in slicing, toolpath planning, and process control. In this talk, we will spotlight recent development in Computer-Aided Manufacturing (CAM) for MAAM, driven by the evolution of geometric representations — from voxel grids and tetrahedral meshes to neural-based implicit models. Robust, scalable algorithms for curved layer slicing and toolpath generation — enabling volume-based material decomposition and tailored reinforcement — will be presented as key enablers for fabricating large, complex objects. Additionally, we will highlight how the integration of robotics motion planning algorithms enables guaranteed collision-free printing, which drives high precision and scalability in the MAAM process.

Speaker’s profile

Dr Guoxin Fang is now an Assistant Professor in the Department of Mechanical and Automation Engineering at The Chinese University of Hong Kong. He received his PhD degree in Design Engineering from Delft University of Technology, Netherlands, in 2022. He also holds a BS degree in Mechanical Engineering from the Beijing Institute of Technology, which he obtained in 2016. Prior to joining CUHK, he worked as a Postdoctoral research associate in digital manufacturing at the University of Manchester, UK. Dr Fang’s research focuses on developing computational techniques to advance manufacturing and robotic systems. He has published over 30 research works in the fields of digital manufacturing, computational design, and robotics. Dr Fang’s research has been recognized with several awards, including the Best Paper Award at the 2022 SIGGRAPH Asia Conference and the Best Paper Award at the ASME IDETC-CIE 2023 conference. He is a member of ASME, IEEE, ACM (SIGGRAPH), and serves as a committee member of the Symposium on Solid & Physical Modeling (SPM) and the ASME Computers and Information in Engineering (CIE) Division.