Highlights
SUTD Breaks New Ground in 3D Printed Soft Robotics
Newly developed resins are tougher and will also allow for more robust integration of mechatronic components in 3D printed multi-material structures.
3D Metalforge commissions new high performance metal printer
Associate Prof Soh Gim Song and team have been working with 3D MetalForge to co-developed the H-WAAM printer, which can print faster, and larger metal parts
Technology makes it easy: 3D printed houses
Channel 8’s Hello Singapore does a spotlight on 3D printed homes, featuring interviews with ASD Assistant Prof Carlos Bañón and ASD PhD student Chiu Po Heng.
Unique method to fabricate freeform structures of thermoplastics in microparticulate gels
Fabrication of 3D freeform structures of thermoplastics involving overhang (non-anchored) structures is successfully showcased by fused …
NEW BOOK: 3D Printing and Additive Manufacturing of Electronics
World Scientific Series in 3D Printing: Volume 3
3D Printing and Additive Manufacturing of Electronics
Principles and Applications
https://doi.org/10.1142/11773 | July 2021 | Pages: 416
Author: Chee Kai Chua (SUTD), Wai Yee Yeong (NTU), Hong Yee Low (SUTD), Tuan Tran (NTU) and
#designspottingsg Ep. 6: Carlos Banon
DesignSingapore Council’s 6th episode of #designspottingsg featured Assistant Professor Carlos Banon, the co-founder of Airlab.
New Method Developed to Create “Food Inks” for 3D Printing Fresh Vegetables
Singapore researchers develop new method for ‘printing’ fresh vegetables, leading to tastier, more nutritious food for patients with …
At the Speed of Light
From NRF RIE Magazine January issue: Associate Prof Dawn Tan’s research allows photonic integrated circuits to unlock their potential as high-resolution 3D photonic structures in ultra-high speed communications.
SUTD research team extends 4D printing to nanophotonics
The newly developed shape memory polymer resist allows for high-resolution 4D printing.
Light Confinement in a 3D Space
SUTD develops technology which allows for photonic integrated circuits to unlock their potential as high resolution 3D photonic structures in ultra-high speed communications.