Highlights

SUTD researchers have developed novel solutions that keep an autonomous vehicle’s perception accurate in rain, darkness and unfamiliar cities.

This prestigious international distinction honours his significant contributions to prognostics and health management (PHM) and the translation of research into practical industrial solutions.

A new framework developed by SUTD researchers could improve how robots, autonomous systems and augmented reality tools recognise objects and navigate complex real-world environments.

Their research project, “Investigating Cross-Lingual Alignment and Semantic Drift in GPT-2 Fine-Tuning.” has been recognised under the Highly Commended in the Computer Science category at the Awards.

HieraScaffold is an AI framework that could help autonomous-driving and robotics teams create large, dynamic simulation environments with less reliance on costly real-world LiDAR data collection.

ISTD PhD student Nan Li has won the Bronze Award at the Student 3MT (Three-Minute Thesis) Pitch Competition which was held as part of the IEEE 6G Summit Singapore 2026.

As artificial intelligence becomes increasingly capable of answering questions, generating code, solving problems, and creating designs, an important question emerges: What remains essential for students to learn and do for themselves? This question took centre stage at the AI in Education (AIEd) Symposium 2026 hosted at SUTD.

The ISTD pillar proudly celebrates several faculty members who have been recognised at the SUTD Awards 2026 on 12 August 2026 for their outstanding contributions to education, research, innovation and academic leadership.

Congratulations to the SUTD recipients of the National Day Awards: Professor Tai Lee Siang, Professor Li Xiaoli, Professor Mohan Rajesh Elara, Dr Lee Chee Huei and Dr Pang Yang Huei.

The ACM Symposium on Solid and Physical Modeling (SPM) 2026 is a premier international conference focused on the geometric and physical modeling of shapes. Held in Istanbul, it showcases advanced research in design, simulation, and manufacturing.