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Chocolate-based Ink Three-dimensional Printing (Ci3DP)
Karyappa and M. Hashimoto, “Chocolate-based Ink Three-dimensional Printing (Ci3DP),,” Scientific Reports, vol. 9, no. 1, p. 14178, 2019/10/02 2019.
Fabrication of Complex 3D Fluidic Networks via Modularized Stereolithography
Ching, Y.-C. Toh, and M. Hashimoto, “Fabrication of Complex 3D Fluidic Networks via Modularized Stereolithography,,” Advanced Engineering Materials, vol. 22, no. 3, p. 1901109, 2020.
Structural color three-dimensional printing by shrinking photonic crystals
Liu et al., “Structural color three-dimensional printing by shrinking photonic crystals,,” Nature Communications, vol. 10, no. 1, p. 4340, 2019/09/25 2019.
Computer-aided Process Planning for Wire Arc Directed Energy Deposition
Y. Xiong, A. G. Dharmawan, Y. L. Tang, G. S. Soh, D. Rosen, “Computer-aided Process Planning for Wire Arc Directed Energy Deposition”, Annual International Solid Freeform Fabrication Symposium, Austin, USA, 2019.
Thoughts on Design for Intelligent Manufacturing
W. Rosen, “Thoughts on Design for Intelligent Manufacturing,,” Engineering, vol. 5, no. 4, pp. 609-614, 2019/08/01/ 2019.
Modified commercial UV curable elastomers for passive 4D printing
Hingorani, Y.-F. Zhang, B. Zhang, A. Serjouei, and Q. Ge, “Modified commercial UV curable elastomers for passive 4D printing,” International Journal of Smart and Nano Materials, vol. 10, no. 3, pp. 225-236, 2019/07/03 2019. https://doi.org/10.1080/19475411.2019.1591540
Injection Molding of Superhydrophobic Submicrometer Surface Topography on Macroscopically Curved Objects: Experimental and Simulation Studies
L. Lee, D. Wang, J. Wu, Q. Ge, and H. Y. Low, “Injection Molding of Superhydrophobic Submicrometer Surface Topography on Macroscopically Curved Objects: Experimental and Simulation Studies,” ACS Applied Polymer Materials, vol. 1, no. 6, pp. 1547-1558, 2019/06/14 2019. https://doi.org/10.1021/acsapm.9b00312
CMOS-Compatible PECVD Silicon Carbide Platform for Linear and Nonlinear Optics
Xing, D. Ma, K. J. A. Ooi, J. W. Choi, A. M. Agarwal, and D. Tan, “CMOS-Compatible PECVD Silicon Carbide Platform for Linear and Nonlinear Optics,,” ACS Photonics, vol. 6, no. 5, pp. 1162-1167, 2019/05/15 2019.
Chemomechanics of dual-stage reprocessable thermosets
Luo et al., “Chemomechanics of dual-stage reprocessable thermosets,” Journal of the Mechanics and Physics of Solids, vol. 126, pp. 168-186, 2019/05/01/ 2019. https://doi.org/10.1016/j.jmps.2019.02.013
Self-Healing Four-Dimensional Printing with an Ultraviolet Curable Double-Network Shape Memory Polymer System
Zhang et al., “Self-Healing Four-Dimensional Printing with an Ultraviolet Curable Double-Network Shape Memory Polymer System,” ACS Applied Materials & Interfaces, vol. 11, no. 10, pp. 10328-10336, 2019/03/13 2019. https://doi.org/10.1021/acsami.9b00359